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CYW989829M2EVB-03 BSP

The Infineon AIROC™ CYW89829 Bluetooth® LE evaluation board (CYW989829M2EVB-03) enables evaluation, prototyping, and development of a wide array of Industrial and Automotive IoT applications using the AIROC™ CYW89829, a low power and high performance Bluetooth® LE MCU.

NOTE: BSPs are versioned by family. This means that version 1.2.0 of any BSP in a family (eg: PSoC™ 6) will have the same software maturity level. However, not all updates are necessarily applicable for each BSP in the family so not all version numbers will exist for each board. Additionally, new BSPs may not start at version 1.0.0. In the event of adding a common feature across all BSPs, the libraries are assigned the same version number. For example if BSP_A is at v1.3.0 and BSP_B is at v1.2.0, the event will trigger a version update to v1.4.0 for both BSP_A and BSP_B. This allows the common feature to be tracked in a consistent way.

What's Included?

The CYW989829M2EVB-03 library includes the following:

  • BSP specific makefile to configure the build process for the board
  • cybsp.c/h files to initialize the board and any system peripherals
  • cybsp_types.h file describing basic board setup
  • Linker script & startup code for GCC, IAR, and ARM toolchains
  • Configurator design files (and generated code) to setup board specific peripherals
  • .lib file references for all dependent libraries
  • API documentation

What Changed?

v1.0.4

  • MPN CYW89829B01MKSBG to CYW89829B0232 update release for CYW89829

v1.0.3

  • Initial production release for CYW89829

v1.0.2

  • Initial production release for CYW20829

v1.0.1

  • MTB 3.0 and pre-production release

v0.5.0

  • Initial pre-production release

Supported Software and Tools

This version of the CYW989829M2EVB-03 BSP was validated for compatibility with the following Software and Tools:

Software and Tools Version
ModusToolbox™ Software Environment 3.1.0
GCC Compiler 11.3.1
IAR Compiler 9.40.2
ARM Compiler 6.16

Minimum required ModusToolbox™ Software Environment: v3.0.0

More information


© Cypress Semiconductor Corporation (an Infineon company) or an affiliate of Cypress Semiconductor Corporation, 2019-2022.