Skip to content

Infineon/TARGET_CYW989820M2EVB-01

main
Switch branches/tags

Name already in use

A tag already exists with the provided branch name. Many Git commands accept both tag and branch names, so creating this branch may cause unexpected behavior. Are you sure you want to create this branch?
Code

Latest commit

 

Git stats

Files

Permalink
Failed to load latest commit information.
Type
Name
Latest commit message
Commit time
 
 
 
 
 
 
 
 

CYW989820M2EVB-01

Overview

The Infineon AIROC™ CYW89820 Bluetooth® and Bluetooth® LE evaluation kit (CYW989820M2EVB-01) enables evaluation, prototyping, and development of a wide array of IoT applications using the AIROC™ CYW89820, an ultra-low-power dual-mode Bluetooth® 5.4 system on chip.

The AIROC™ CYW89820 Bluetooth® and Bluetooth® LE system on chip provides reliable Bluetooth® connectivity, core spec compliant to 5.4, along with high-performance compute capability integrating an Arm® Cortex®-M4 processor with floating point unit. It is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2 dBm in EDR mode. The AIROC™ CYW89820 is designed to support a wide range of Bluetooth® use cases for automotive and industrial applications.

The AIROC™ CYW89820 Bluetooth® and Bluetooth® LE evaluation kit (CYW989820M2EVB-01) and the AIROC™ Bluetooth® SDK along with ModusToolbox™ software and tools form a powerful but easy to use toolset that helps developers create amazing Bluetooth® enabled IoT solutions.

Kit Features

  • AIROC™ CYW89820 Bluetooth® and Bluetooth® LE system on chip in 48 pin WQFN package
  • Arduino compatible headers for hardware expansion
  • User switches and LEDs
  • USB connector for power, programming, and USB-UART bridge

Kit Contents

  • Base Board - CYW9BTM2BASE2
  • CYW989820M2IPA1 Bluetooth® Module Evaluation Board (mounted onto baseboard)
  • USB Standard-A to Micro-B cable

About

No description, website, or topics provided.

Resources

License

Stars

Watchers

Forks

Packages

No packages published