IIDC-062S2-MUR-43022 BSP

Overview

The IIDC-062S2-MUR-43022 is a compact, turnkey System-on-Module (SoM) from Infineon, built around the PSoC™ 6 dual-core MCU and AIROC™ CYW43022 Wi-Fi 5 chip, with an onboard OPTIGA™ Trust M secure element and 64 Mbit Flash for security and storage. It ships with a configurable firmware package that covers high-frequency sensor data acquisition, on-node preprocessing, and out-of-the-box secure connectivity including WPA2-PSK, WPA2-Enterprise 802.1X, MQTT/Sparkplug B, and HTTPS, as well as MCUboot-based Over-the-Air (OTA) updates. The module is one component of the broader Infineon Industrial Data Connect solution, which combines this hardware with configurable firmware an on-premise backend (device registry, MQTT broker, InfluxDB), and a frontend dashboard to carry sensor data from the edge node all the way to the customer backend. Together, these components form a production-ready, scalable platform for industrial IoT sensing use cases with minimal integration effort.

To use code from the BSP, simply include a reference to cybsp.h.

Features

Kit Features:

IIDC-062S2-MUR-43022 module
Free application processor (100-MHz Arm® Cortex®-M4) and secondary processor (100-MHz Arm® Cortex®-M0+)
Support of up to 2MB Internal Flash and 1MB Internal SRAM.
64-Mbit onboard Quad SPI NOR Flash that provides a fast, expandable memory for OTA
OPTIGA Trust M advanced security controller onboard for secure data storage
Murata 2GF WiFI/BT combo with Infineon CYW43022 WiFi-BT IC.
32Mhz 7ppm Chrystal for ECO
32.768 kHz Chrystal for WCO
32.768 LPO for Murata 2GF
onboard U.FL Antenna connector + extra antenna PinOut

Kit Contents:

IIDC-062S2-MUR-43022 Infineon Industrial Connect Data Connect Module

BSP Configuration

The BSP has a few hooks that allow its behavior to be configured. Some of these items are enabled by default while others must be explicitly enabled. Items enabled by default are specified in the bsp.mk file. The items that are enabled can be changed by creating a custom BSP or by editing the application makefile.

Components:

Device specific category reference (e.g.: CAT1) - This component, enabled by default, pulls in any device specific code for this board.

Defines:

CYBSP_WIFI_CAPABLE - This define, disabled by default, causes the BSP to initialize the interface to an onboard wireless chip if it has one.
CY_USING_HAL - This define, enabled by default in some BSPs, specifies that the HAL is intended to be used by the application. This will cause the BSP to include the applicable header file and to initialize the system level drivers. Newer BSPs pull in the v3.x HAL, which enables itself via its own makefile, so CY_USING_HAL is not present.
CYBSP_CUSTOM_SYSCLK_PM_CALLBACK - This define, disabled by default, causes the BSP to skip registering its default SysClk Power Management callback, if any, and instead to invoke the application-defined function cybsp_register_custom_sysclk_pm_callback to register an application-specific callback.

Clock Configuration

Clock	Source	Output Frequency
FLL	ECO	100.0 MHz
PLL	ECO	48.0 MHz
CLK_HF0	CLK_PATH0	100 MHz
CLK_HF2	CLK_PATH0	100 MHz

Power Configuration

System Active Power Mode: LP
System Idle Power Mode: Deep Sleep
VDDA Voltage: 3300 mV
VDDD Voltage: 1800 mV

See the BSP Setttings for additional board specific configuration settings.

API Reference Manual

The IIDC-062S2-MUR-43022 Board Support Package provides a set of APIs to configure, initialize and use the board resources.

See the BSP API Reference Manual for the complete list of the provided interfaces.

More information

IIDC-062S2-MUR-43022 BSP API Reference Manual
IIDC-062S2-MUR-43022 Documentation
Infineon Technologies AG
Infineon GitHub
ModusToolbox™

© Infineon Technologies AG or an affiliate of Infineon Technologies AG, 2019-2026.

License

Infineon/TARGET_IIDC-062S2-MUR-43022

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