This repo provides the build recipe make files and scripts for building and programming CYW55513 applications. Builds can be run either through a command-line interface (CLI) or through the Eclipse IDE for ModusToolbox.
This release of the CYW55513 GNU make build recipe includes complete support for building, programming, and debugging CYW55513 application projects. It is expected that a code example contains a top level make file for itself and references a Board Support Package (BSP) that defines specific items, like the CYW55513 part, for the target board. Supported functionality includes the following:
- Supported operations:
- Build
- Program
- Debug
- IDE Integration (Eclipse, VS Code, IAR, uVision)
- Supported toolchains:
- GCC
- IAR
- ARM Compiler 6
This also includes the getlibs.bash script that can be used directly, or via the make target to download additional git repo based libraries for the application.
- Fixed a bug causing image to not boot from RAM
- Fixed a bug causing incorrect XIP alignment
- CYW55513 device support added
- Minor change to symbol file handling
- Initial production release
Builds require that the ModusToolbox tools be installed on your machine. This comes with the ModusToolbox install. On Windows machines, it is recommended that CLI builds be executed using the Cygwin.bat located in ModusToolBox/tools_x.y/modus-shell install directory. This guarantees a consistent shell environment for your builds.
To list the build options, run the "help" target by typing "make help" in CLI. For a verbose documentation on a specific subject type "make help CY_HELP={variable/target}", where "variable" or "target" is one of the listed make variables or targets.
This version of the CYW55513 build system was validated for compatibility with the following Software and Tools:
Software and Tools | Version |
---|---|
ModusToolbox Software Environment | 3.2 |
GCC Compiler | 11.3 |
IAR Compiler | 9.3 |
ARM Compiler | 6.16 |
Minimum required ModusToolbox Software Environment: v3.2
© Cypress Semiconductor Corporation, 2022-2024.